SEMICON India 2026 Day 2 Sees 25 MoUs, Strategic Collaborations Across Semiconductor Value Chain

The second day of SEMICON India 2026 at Yashobhoomi, New Delhi, on Friday witnessed 25 MoUs/announcements and strategic collaborations across semiconductor materials, manufacturing, power electronics, advanced packaging, logistics, design and skilling, further strengthening India’s capabilities across the semiconductor value chain.

The initiatives, involving Indian and global ecosystem partners, covered localisation of critical materials, indigenous Silicon Carbide power technologies, semiconductor design tools, deep-tech investment, specialised logistics and workforce development.

The day’s deliberations brought together policymakers, global semiconductor leaders, Indian industry, researchers, startups, academia and students to discuss manufacturing, supply chains, research and development (R&D), international partnerships, chip design, advanced packaging, materials and talent, reflecting India’s progress towards an integrated and globally competitive “Silicon to Systems” ecosystem, according to a press release by Ministry of Electronics & IT.

In a fireside conversation, Union Minister for Electronics and Information Technology, Railways, and Information and Broadcasting Ashwini Vaishnaw said India’s semiconductor mission had moved from proving intent to execution at scale.

He said ISM 2.0 would build on the foundation created under ISM 1.0 through six pillars — design; machines and materials; setting up more fabs; strengthening the ATMP/OSAT industry; research and development; and talent development.

The minister said ISM 1.0, originally envisaged as a six-year programme, achieved its objectives in just four years. He expressed confidence that ISM 2.0 would similarly progress ahead of schedule, backed by strong and growing investor interest.

Highlighting design as one of India’s core strengths, Vaishnaw estimated that at least 200 chip design companies would emerge under ISM 2.0, describing the development as a “game changer” for building home-grown semiconductor intellectual property.

More than 105 chip design startups have gained access to state-of-the-art Electronic Design Automation (EDA) tools, with 20 startups securing venture capital funding. Around 70,000 chip-design engineers have been trained in four years against a target of 85,000, the press release stated.

The minister emphasised that global competitiveness requires both quality and competitive costs, and noted that five of the 12 plants approved under ISM 1.0 have commenced commercial production. He also underlined India’s recognition as a trusted country and its strong record in intellectual property protection.

Vaishnaw highlighted the strong domestic and international response to SEMICON India 2026, extensive business-to-business engagements and significant participation from major semiconductor economies.

He said the Country Roundtables demonstrated growing interest among global companies in expanding their engagement with India. The minister also highlighted India’s transition from design services towards becoming a “Product Nation”, with Indian-designed chips increasingly moving into end products.

He emphasised machines and materials, specialised semiconductor logistics, sustainability, water recycling and industry-ready talent as important elements of the emerging semiconductor ecosystem.

Foreign Secretary Vikram Misri emphasised that resilient semiconductor value chains require trusted global partnerships. He highlighted reliability, credibility, incentives and value creation as pillars of cooperation, and called for a balanced approach to self-reliance based on domestic strengths combined with global capabilities.

-with PIB inputs

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